Verwandeln Sie veraltete, überschüssige und Lagerbestands-IC-Chips in flüssiges Kapital. Wir bieten zertifizierte, durchgängige B2B-Vermögensrückgewinnungs- und Recyclinglösungen für elektronische Komponenten für OEMs, ODMs, EMS-Anbieter und Händler weltweit, mit maximaler Wertwiedergewinnung, strenger Datenbereinigung und voller Einhaltung internationaler Umweltstandards.
In the fast-evolving electronics manufacturing industry, inventory depreciation and supply chain volatility pose significant threats to operational profitability. Rapid product release cycles, sudden demand fluctuations, order cancellations, and component end-of-life (EOL) announcements frequently leave original equipment manufacturers (OEMs), contract electronics manufacturers (CEMs), electronic manufacturing services (EMS), and franchised distributors burdened with dormant capital in the form of surplus Integrated Circuit (IC) chips.
Accumulating surplus semiconductor components ties up warehouse capacity, inflates holding overhead, incurs insurance expenses, and increases the financial risk of complete asset obsolescence. Our specialized B2B semiconductor asset recovery division solves this dilemma. We bridge the critical gap between supply-chain surplus and secondary industrial reuse, offering global procurement teams a secure, compliant, and lucrative channel to liquidate unused integrated circuits while supporting sustainable, circular economy practices.
An Integrated Circuit (commonly abbreviated as an IC or microchip) is an assembly of miniaturized electronic components—such as transistors, diodes, resistors, and capacitors—diffused and interconnected on a single semiconductor substrate, primarily silicon. As the computational core and nervous system of every electronic system, ICs represent the highest-value sub-segment of electronic components in the secondary market.
In the context of industrial buyback, excess liquidation, and e-waste reclamation, IC chips generally fall into two broad asset tiers:
Commercial-Grade Surplus & Usable Overstock: Intact, original factory packaging (Tape & Reel, Tubes, Trays, Sealed Anti-Static Bags) that can be redistributed into authorized secondary supply channels, providing instant cash liquidity.
Non-Functional, Damaged, or E-Waste Chips: Broken, stripped, or scrap semiconductor materials that are routed to certified precious-metal reclamation and chemical refining facilities to recover precious raw elements like gold, silver, copper, and palladium.
Our global procurement network purchases active, passive, legacy, hard-to-find, and obsolete silicon components across all industry sectors. We accept factory-sealed lots, mixed lots, continuous factory over-runs, and surplus warehouse liquidations:
| Category | Typical Functions & Sub-Types | Prominent Part Numbers / Families | Typical Applications |
| Microcontrollers (MCUs) & MPUs | 8-bit, 16-bit, 32-bit RISC/ARM processors, real-time control units | STM32, PIC, ATmega, ESP32, NXP i.MX | Industrial automation, IoT, automotive, smart consumer electronics |
| Memory & Storage ICs | DRAM (DDR3/4/5), SRAM, NOR Flash, NAND Flash, eMMC, UFS | Micron, Samsung, SK Hynix, Winbond, Kioxia | Servers, smartphones, computing, network switches |
| Logic & Programmable Devices | FPGAs, CPLDs, standard logic gates, flip-flops, buffers | Xilinx Artix/Kintex/Virtex, Intel/Altera Cyclone/Stratix | Aerospace, telecommunications, medical imaging, high-speed computing |
| Power Management (PMICs) | DC-DC converters, LDO regulators, battery management, switching controllers | Texas Instruments (TI), Analog Devices (ADI), ON Semi | Power supplies, EV powertrains, mobile devices |
| Analog & Mixed-Signal ICs | Operational amplifiers (Op-Amps), ADCs, DACs, sensor interfaces | AD822, INA series, MAXIM interface transceivers | Precision instrumentation, audio processing, sensor signal conditioning |
| Interface & Communication | Ethernet transceivers (PHY), RS-485/422, CAN bus, USB controllers | Realtek, Microchip, TI SN65 series | Automotive telemetry, networking equipment, industrial fieldbuses |
| RF & Microwave ICs | Power amplifiers, mixers, RF front-ends, low-noise amplifiers (LNAs) | Skyworks, Qorvo, Broadcom | Cellular infrastructure, 5G base stations, radar equipment |
Regardless of the packaging tier, our inspection facilities are equipped to handle diverse structural form factors in standard ESD-safe packaging:
Surface Mount Technology (SMT): QFP, TQFP, LQFP, BGA, FBGA, LGA, QFN, DFN, SOP, SSOP, TSSOP, SOT-23, SOT-223.
Through-Hole Technology (THT): DIP, PDIP, CDIP, TO-220, TO-247, SIP.
Packaging Types: Carrier Tape & Reel (full, partial, or split reels), Plastic Anti-Static Trays (JEDEC standard), Anti-Static Tubes/Sticks, and Bulk Dry-Packs (with intact moisture barrier bags and desiccant indicators).
Recognizing that enterprise organizations operate under varied internal accounting policies, capital objectives, and regulatory requirements, we provide customized partnership models:
Direct Outright Purchase (Immediate Cash Settlement): Best suited for organizations needing immediate balance-sheet relief and free warehouse space. We evaluate your excess bill of materials (BOM), submit a firm cash bid for the entire lot, arrange freight, and disburse full payment prior to shipping.
Consignment Inventory Management: Designed for enterprises holding high-value, active semiconductor lots where maximizing financial yield is prioritized over instant liquidity. Your inventory remains secured in our climate-controlled, ESD-compliant bonded warehousing, marketed across our verified global buyers network, and settled on monthly payout cycles.
Revenue Sharing / Hybrid Liquidation: A structured program where fast-moving parts are purchased directly, while specialized, long-tail chips are marketed on an agreed profit-split arrangement.
Recycling & Precious Metal Refining: Tailored for production scraps, engineering rejects, non-working boards, and obsolete chips. We extract valuable trace metals—such as gold bonding wire and copper lead frames—providing a certified certificate of destruction alongside scrap recovery credits.
Brand protection, trace verification, and anti-counterfeit measures are foundational to our operating model. Our incoming testing protocols comply with IDEA-STD-1010 and AS6081 guidelines:
Visual & Packaging Verification: Inspecting carrier tapes, labels, barcode consistency, factory seals, humidity indicator cards (HIC), and signs of oxidation or lead re-tinning.
Optical Microscopic Examination: Verifying pin integrity, coplanarity, mold markings, font styles, laser etch depth, and surface textures to screen for blacktopping or ghost markings.
Acetone & Marking Permanence Testing: Verifying surface coatings against aggressive solvents to ensure authentic manufacturer finishes.
X-Ray & Radiographic Inspection: Non-destructive structural inspection assessing internal lead frame design, die placement, and bonding wire integrity against official manufacturer silicon dies.
Decapsulation & Die Analysis (When Necessary): Acid-etching packaging layers to expose and inspect silicon dies, verifying native manufacturer logos, revisions, and mask sets.
Managing transnational surplus components requires precision, legal diligence, and logistical agility. Our logistics and compliance frameworks feature:
Worldwide Door-to-Door Logistics: We handle pick-up, secure crating, insured customs clearance, and global transportation via DHL, FedEx, UPS, and freight forwarding partners across North America, Europe, Southeast Asia, and Greater China.
Strict ESD & MSL Preservation: All received semiconductor lots are processed inside certified ANSI/ESD S20.20-compliant clean environments and stored in dry-storage cabinets according to IPC/JEDEC J-STD-033 moisture sensitivity levels.
Export Controls & Trade Sanctions Compliance: Full adherence to global export control regimes (including US EAR, EU Dual-Use regulations, and Wassenaar Arrangement guidelines). We never divert sensitive technologies to prohibited destinations or sanctioned entities.
Environmental Responsibility (WEEE & RoHS): Comprehensive adherence to zero-landfill electronic scrap guidelines, utilizing ISO 14001 and R2-aligned refining channels to prevent hazardous electronic waste accumulation.
We make excess inventory monetization straightforward and transparent:
Submit Your Excess List: Send your component manifest in Excel or CSV format containing Manufacturer Part Numbers (MPN), brand names, date codes (D/C), quantities, and package formats.
Algorithmic Pricing & Formal Quotation: Our procurement analysts evaluate global historical demand, real-time spot shortages, and market pricing to return an offer within 24 to 48 hours.
Payment Disbursal & Arranged Pick-up: Upon accepted terms, we issue payment via wire transfer (T/T), Letter of Credit, or Escrow, and arrange all shipping and handling from your warehouse dock.
Final In-House Verification & Reporting: Upon arrival, goods undergo standard lot verification, followed by the immediate issuance of receiving manifests, inventory sign-offs, and optional certificates of data sanitization or destruction.
To provide the highest possible bid, please include the Complete Manufacturer Part Number (MPN), Brand/Manufacturer, Quantity, Date Code (D/C), Lot Condition (Factory Sealed, Open Box, Tape/Reel, Loose Trays), and current warehouse location.
Yes. We actively source mature, obsolete, and discontinued chips. Many industrial, medical, and defense systems rely on legacy components that are no longer supported by original chip foundries.
Non-Disclosure Agreements (NDAs) are executed prior to inventory review upon request. If requested, customized proprietary markings or specific silicon codes can be sanitized, de-branded, or crushed in certified destruction chambers with complete video-recorded chain-of-custody documentation.
TSDTech liefert eine breite Palette elektronischer Bauteile, darunter Leistungsmanagement-ICs, Mikrocontroller (MCUs), Kommunikations-ICs, MOSFETs, Gleichrichterbrücken, IGBTs und elektronische Komponenten für die Automobilindustrie.
Das Produktportfolio von TSDTech umfasst Komponenten führender Halbleitermarken wie Texas Instruments (TI), Analog Devices (ADI), NXP, STMicroelectronics (ST), Microchip, Atmel, Infineon und Renesas.
TSDTech hält einen umfangreichen Bestand an neuen originalen elektronischen Bauteilen, um die Beschaffungsanforderungen der Kunden zu unterstützen. Kunden können das Team kontaktieren, um die Verfügbarkeit von Produkten, Spezifikationen und Beschaffungsoptionen für bestimmte Teilenummern zu bestätigen.
TSDTech bietet Lieferkettenservices für globale elektronische ODM-, OEM- und EMS-Kunden sowie für kleine und mittelständische Elektronikhersteller mit vielfältigen Komponentenbeschaffungsbedürfnissen.
Ja. TSDTech unterstützt die Beschaffung und Lieferung von Bauteilen in großen Mengen für Geschäftskunden. Bestellmengen, Lagerverfügbarkeit, Preise und Liefervereinbarungen können basierend auf spezifischen Teilenummern und Projektanforderungen besprochen werden.
Ja. TSDTech unterstützt Kunden bei der Beschaffung elektronischer Bauteile aus verschiedenen Produktkategorien und Halbleiter-Marken. Kunden können eine Stückliste (BOM) oder eine Liste der benötigten Teilenummern zur Beschaffungshilfe einreichen.
Seit seiner Gründung im Jahr 2005 hat TSDTech laut Unternehmensinformationen Verbindungen zu mehr als 200 SMT-Fabriken aufgebaut und die Bedürfnisse von über 4.000 kleinen und mittelständischen Endgeräteherstellern unterstützt.
TSDTech vereint Branchenerfahrung, ein breites Bauteile-Portfolio, originale Lagerbestände und ein etabliertes Kundennetzwerk. Das Unternehmen verpflichtet sich zu ehrlichen Geschäftspraktiken und unterstützt die vielfältigen Beschaffungsbedürfnisse globaler Elektronikhersteller.